| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable silicone resin composition giving a cured product which has high resistance to a repeating thermal shock, hardly generates cracks even under a severe temperature cycle, has excellent discoloration resistance when exposed to high temperature for a long time and is capable of preventing permeation of gasses such as SOx and which is useful as a material, such as an LED element sealing material, for optical devices and optical components, an insulating material for electronic devices and electronic components and a coating material, and to provide a cured product of the curable silicone resin composition and an optical semiconductor device.SOLUTION: The curable silicone resin composition contains: (A) a (A-1) component or (A-1) and (A-2) components, where the (A-1) component is a compound expressed by formula (1) and has at least two aliphatic unsaturated groups in one molecule and the (A-2) component is expressed by formula (2) and is a branched or three-dimensional-network structure organopolysiloxane; (B) an organosilicon compound having at least two hydrogen atoms bonded to a silicon atom in one molecule and no aliphatic unsaturated group; (C) a hydrosilylation catalyst; and (D) silicone powder. The cured product obtained from the addition curable silicone resin composition has high resistance to the repeating thermal shock, hardly generates cracks even under the severe temperature cycle, has excellent discoloration resistance when exposed to high temperature for the long time and is capable of preventing permeation of sulfur oxide gas. As a result, the cured product is useful as a material for the optical semiconductor device to be used under a severer environment. |
