发明名称 |
SUBSTRATE LAMINATION APPARATUS |
摘要 |
PROBLEM TO BE SOLVED: To provide a substrate lamination apparatus capable of laminating substrates with high accuracy.SOLUTION: A substrate lamination apparatus 1 executes: control for relatively positioning a display substrate 101 supported by a substrate support part 86 provided at a lower member 8 and a substrate 121 with a touch sensor retained by a substrate retention part 11 by driving a lower member movement mechanism 9 to move the substrate support part 86 on the basis of detection results from imaging parts 5A and 5B; control for making a vacuum case 10 under vacuum by deaerating the vacuum case 10 to have a predetermined degree of vacuum; and control for laminating both substrates 101 and 121 by lowering the substrate retention part 11 to be disposed at a lamination position. A pressing part 13 presses four corners of the display substrate 101 at the lamination position in such a direction as to be closer to the panel 121 with a touch sensor. A temporary fixing light source radiates ultraviolet rays to cure UV-curing resin interposed between both substrates 101 and 121. |
申请公布号 |
JP2013218198(A) |
申请公布日期 |
2013.10.24 |
申请号 |
JP20120090096 |
申请日期 |
2012.04.11 |
申请人 |
HITACHI HIGH-TECHNOLOGIES CORP |
发明人 |
YAMAZAKI FUJIO;KATAOKA FUMIO;MUNETO MASATOSHI |
分类号 |
G09F9/00;G02F1/1339 |
主分类号 |
G09F9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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