发明名称 SUBSTRATE LAMINATION APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a substrate lamination apparatus capable of laminating substrates with high accuracy.SOLUTION: A substrate lamination apparatus 1 executes: control for relatively positioning a display substrate 101 supported by a substrate support part 86 provided at a lower member 8 and a substrate 121 with a touch sensor retained by a substrate retention part 11 by driving a lower member movement mechanism 9 to move the substrate support part 86 on the basis of detection results from imaging parts 5A and 5B; control for making a vacuum case 10 under vacuum by deaerating the vacuum case 10 to have a predetermined degree of vacuum; and control for laminating both substrates 101 and 121 by lowering the substrate retention part 11 to be disposed at a lamination position. A pressing part 13 presses four corners of the display substrate 101 at the lamination position in such a direction as to be closer to the panel 121 with a touch sensor. A temporary fixing light source radiates ultraviolet rays to cure UV-curing resin interposed between both substrates 101 and 121.
申请公布号 JP2013218198(A) 申请公布日期 2013.10.24
申请号 JP20120090096 申请日期 2012.04.11
申请人 HITACHI HIGH-TECHNOLOGIES CORP 发明人 YAMAZAKI FUJIO;KATAOKA FUMIO;MUNETO MASATOSHI
分类号 G09F9/00;G02F1/1339 主分类号 G09F9/00
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