SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

摘要

A semiconductor package including a circuit board including a plurality of pads; a support structure disposed on the circuit board; and a plurality of semiconductor chips stacked on the circuit board and the support structure, each semiconductor chip including at least one pad. For each semiconductor chip, the at least one pad is aligned with a corresponding pad of the circuit board; and an electrical connection is formed between the at least one pad and the corresponding pad of the circuit board through the support structure.