Method for polishing semiconductor wafer, involves providing functional layer of polishing cloth with pores and small blind holes which are arranged in radially inward region and radially outward region
摘要
<p>The method involves polishing the sides of a semiconductor wafer simultaneously using the polishing agent adhered in a polishing cloth which is provided on a polishing plate. The active polishing cloth surface (1) is provided in contact with a surface of the semiconductor wafer. The functional layer (3) of the polishing cloth is provided with pores (2) and small blind holes (4) which are arranged in a radially inward region and a radially outward region. The active surface of polishing cloth is made of polyurethane foam material.</p>
