发明名称 LASER BONDING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a reliable laser bonding method for bonding a resin and a metal, configured to prevent thermal decomposition of resin without influence of light absorptivity of metal.SOLUTION: A laser bonding method is used for a pressing material made of metal or ceramics. Resin and metal is pressed from the metal side with the pressing material. The pressing material is laser-irradiated. Heat of the laser beam is thermally transferred via the metal from the pressing material to the resin for join them. High-strength, bubble-less, and highly reliable laser bonding can be achieved between the resin and the metal in a short tact.
申请公布号 JP2013216028(A) 申请公布日期 2013.10.24
申请号 JP20120089809 申请日期 2012.04.11
申请人 HITACHI LTD 发明人 ARAI SATOSHI;SENDA KENJI
分类号 B29C65/16;B23K26/18;B23K26/32 主分类号 B29C65/16
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