| 摘要 |
PROBLEM TO BE SOLVED: To provide a laser machining device capable of holding a wafer without damaging the wafer by air suction.SOLUTION: A laser machine device 1 includes a holding base 10, a suction device 4, a laser irradiation device 2, a first mobile device (a rotation device 11, an X-axis mobile device 12, and a Y-axis mobile device 13), and a controller 8. The holding base 10 includes a porous layer 15 formed by sintering a grain object. |
