发明名称 |
DEVICE AND METHOD FOR HOLDING SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To stably hold a substrate.SOLUTION: A substrate holding device according to an embodiment includes a first suction holding part and a second suction holding part. The first suction holding part sucks and holds a substrate in a non-contact state by jetting a fluid to generate a negative pressure between the substrate and the first suction holding part. The second suction holding part sucks and holds the substrate using a force generated between the substrate and the second suction holding part by applying a voltage. |
申请公布号 |
JP2013219070(A) |
申请公布日期 |
2013.10.24 |
申请号 |
JP20120085513 |
申请日期 |
2012.04.04 |
申请人 |
TOKYO ELECTRON LTD |
发明人 |
IWASHITA TAIJI;HIRAKAWA OSAMU;SOMA YASUTAKA;TAMURA TAKESHI;FUKUTOMI AKIRA |
分类号 |
H01L21/677;B65G49/07 |
主分类号 |
H01L21/677 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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