发明名称 DEVICE AND METHOD FOR HOLDING SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To stably hold a substrate.SOLUTION: A substrate holding device according to an embodiment includes a first suction holding part and a second suction holding part. The first suction holding part sucks and holds a substrate in a non-contact state by jetting a fluid to generate a negative pressure between the substrate and the first suction holding part. The second suction holding part sucks and holds the substrate using a force generated between the substrate and the second suction holding part by applying a voltage.
申请公布号 JP2013219070(A) 申请公布日期 2013.10.24
申请号 JP20120085513 申请日期 2012.04.04
申请人 TOKYO ELECTRON LTD 发明人 IWASHITA TAIJI;HIRAKAWA OSAMU;SOMA YASUTAKA;TAMURA TAKESHI;FUKUTOMI AKIRA
分类号 H01L21/677;B65G49/07 主分类号 H01L21/677
代理机构 代理人
主权项
地址