| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate assembly which securely improves the connection strength between a mother substrate and a slave substrate and achieves small work hours in the manufacturing.SOLUTION: In a substrate assembly 60, since a part of a second through hole 75 is positioned outside a first through hole 73, when a mother substrate 66 is connected with a slave substrate 62 by solder S filling the first through hole 73, the solder S is easily supplied to the second through hole 75. Therefore, the second through hole 75 is unfailingly filled with the solder S. Further, after soldering, an operator can check if the second through hole 75 is filled with the solder S by visual inspection. Thus, the connection strength between the mother substrate 66 and the slave substrate 62 is unfailingly improved. Furthermore, the solder S supplied from the one surface side of the slave substrate 62 is easily flowed to the opposite side passing through the through hole 75. Hence, it is not necessary to perform the soldering from both surface sides of the slave substrate 62 and the manufacturing work hours is reduced. |
