THREE DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME
摘要
<p>PURPOSE: A three dimensional semiconductor memory device and a method for fabricating the same are provided to improve the degree of integration by reducing the vertical height of a laminate structure. CONSTITUTION: A laminate structure (200) includes gate patterns (150) and oxide patterns (112). The gate patterns and the oxide patterns are alternately laminated on a substrate. A channel structure (210) passes through the laminate structure. The channel structure is connected to the substrate. A vertical insulator (121) is formed between the laminate structure and the channel structure.</p>
申请公布号
KR20130116607(A)
申请公布日期
2013.10.24
申请号
KR20120039154
申请日期
2012.04.16
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
JANG, BYONG HYUN;YUN, JANG GN;SEOL, KWNAG SOO;CHOI, JUNG DAL;KIM, BYONG JU;PARK, KWANG MIN;YANG, JUN KYU;LIM, SEUNG HYUN