发明名称 THREE DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME
摘要 <p>PURPOSE: A three dimensional semiconductor memory device and a method for fabricating the same are provided to improve the degree of integration by reducing the vertical height of a laminate structure. CONSTITUTION: A laminate structure (200) includes gate patterns (150) and oxide patterns (112). The gate patterns and the oxide patterns are alternately laminated on a substrate. A channel structure (210) passes through the laminate structure. The channel structure is connected to the substrate. A vertical insulator (121) is formed between the laminate structure and the channel structure.</p>
申请公布号 KR20130116607(A) 申请公布日期 2013.10.24
申请号 KR20120039154 申请日期 2012.04.16
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 JANG, BYONG HYUN;YUN, JANG GN;SEOL, KWNAG SOO;CHOI, JUNG DAL;KIM, BYONG JU;PARK, KWANG MIN;YANG, JUN KYU;LIM, SEUNG HYUN
分类号 H01L27/115;H01L21/8247 主分类号 H01L27/115
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