| 摘要 |
PURPOSE: A device and a method for measuring the thickness of a printed circuit board are provided to automatically measure the thickness of insulating layers of the printed circuit board in a short time. CONSTITUTION: A device (100) for measuring the thickness of a printed circuit board includes an impedance measuring unit (120) and a thickness calculating unit (130). The measuring device measures the thickness of at least one insulating layer of the printed circuit board. The insulating layer has a signal line on the top. The impedance measuring unit inputs a plurality of input signals having different frequencies into the signal line, receives a plurality of output signals from the signal line, and determines a plurality of impedance values in respect to the insulating layers based on the input signals and the output signals. The thickness calculating unit calculates the thickness of the insulating layers based on the impedance values. [Reference numerals] (110) PCB handling unit; (120) Impedance measuring unit; (122) RF process; (130) Thickness calculating unit; (140) Thickness comparing unit |
