PHOTOSENSITIVE RESIN COMPOSITION, FILM-SHAPED RESIN, RESIN SHEET, RESIN PATTERN, SEMICONDUCTOR WAFER WITH RESIN LAYER, TRANSPARENT SUBSTRATE WITH RESIN LAYER, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in pattern forming property, embeddability and connectability, a film-shaped resin using the photosensitive resin composition, a resin sheet, a resin pattern, a semiconductor wafer with a resin layer, a transparent substrate with a resin layer, a semiconductor device and a method for manufacturing a semiconductor device.SOLUTION: The present invention relates to a photosensitive resin composition which includes an acrylic polymer having a structural unit represented by formula (1), a (meth)acrylate compound, an epoxy resin and a photoinitiator. In the formula, Rrepresents H or methyl; Rrepresents 1-4C alkyl, and x denotes an integer of 0-4.