| 摘要 |
PROBLEM TO BE SOLVED: To provide a means which can improve rising of a polishing rate after wet idling.SOLUTION: In this polishing device which includes: a base polishing mechanism 2 which rotates a base W and a polishing pad 22 relatively to abut on each other, and slurry is supplied to an abutment part while bringing into press contact with each other to polish a surface of the base; and a dress mechanism 3 which rotates the polishing pad 22 and a dresser 32 relatively to abut on each other to perform dressing a surface of the polishing pad 22, a slurry supply mechanism 4 for supplying the dress mechanism 3 with slurry is provided, and the polishing device 1 is configured so that when the polishing pad 22 is performed dressing by the dress mechanism 3, the slurry supply mechanism 4 supplies the abutment part of the polishing pad 22 and the dresser 32 with base polishing slurry, and the polishing pad 22 is performed dressing under supply of slurry. |
