SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, OPTICAL PRINT HEAD USING THE SAME AND IMAGE FORMATION APPARATUS

摘要

PROBLEM TO BE SOLVED: To achieve downsizing and reduction in material cost.SOLUTION: A semiconductor device manufacturing method comprises: a process of forming a peeling layer 124 on a first semiconductor substrate 120; a process of forming semiconductor films 140b on the peeling layer 124; a process of forming a trench 131 which makes a width Wof the semiconductor films 140b be 300 μm or less and has a depth to expose the peeling layer 124; a process of etching the peeling layer 124 to remove the peeling layer 124; a process of transferring and bonding the semiconductor films 140b on a second semiconductor substrate; and a process of forming on the second semiconductor substrate, individual wiring layers each composed of a conductive thin film so as to include on the semiconductor films.