| 发明名称 |
POLISHING SLURRY COMPOSITION |
| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing slurry composition which effectively inhibits dishing caused by chemical mechanical polishing.SOLUTION: Provided is a polishing slurry composition, including a non-ionic surfactant represented by the specified formula (1), where x is an integer in the range from 1 to 50. |
| 申请公布号 |
JP2013219361(A) |
申请公布日期 |
2013.10.24 |
| 申请号 |
JP20130082334 |
申请日期 |
2013.04.10 |
| 申请人 |
UWIZ TECHNOLOGY CO LTD |
发明人 |
CHEN WEI-JUNG;SAI BUNZAI;WU HO-YING;CHANG SONG-YUAN;LU MING-HUI |
| 分类号 |
H01L21/304;B24B37/00;C09K3/14 |
主分类号 |
H01L21/304 |
| 代理机构 |
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