| 摘要 |
PROBLEM TO BE SOLVED: To provide a cleaning method and a cleaning device which allow for effective removal of polishing dust and shavings in fine through holes without using a high pressure pump.SOLUTION: When cleaning the interior of fine through holes in a copper-clad substrate, cleaning water is supplied to the surface of a copper-clad substrate conveyed by means of a conveyance roller, and passed between a plurality of rollers (push rollers) for pushing the cleaning water on the upper side into fine through holes, and a roller (press roller) for pressing the copper-clad substrate on the lower side. Interior of the fine through holes is cleaned by supplying the cleaning water retained on the copper-clad substrate surface by means of the push rollers. |
