| 摘要 |
Provided is a semiconductor device that exhibits little pressure loss and that is capable of uniformly cooling a plurality of power semiconductor chips. A semiconductor device (1) is provided with a semiconductor module (30), and a cooler (50) for cooling power semiconductor elements mounted within the semiconductor module. A cooling section (51) of the cooler (50) comprises: a first header section (54) for supplying refrigerant from a refrigerant introduction section (52) to a cooling fin (41) side, said first header section (54) being provided with a first bottom surface, which inclines toward the bottom surface of the cooling fin (41) and which is between the refrigerant introduction section (52) and the end of a first substrate (33-1) on a refrigerant discharge section (53) side; and a second header section (55) for discharging the refrigerant discharged from the cooling fin (41) side to the refrigerant discharge section (53), said second header section (55) being provided with a second bottom surface that inclines away from the position of the end of the bottom surface of the cooling fin (41) on the refrigerant discharge section (53) side. |
