| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for processing a sapphire wafer in which a cutting blade rotating at a high speed can divide the sapphire wafer into chips.SOLUTION: A method for processing a sapphire wafer cuts and divides the sapphire wafer with a cutting blade rotating at a high speed. The method includes: a holding step for holding the sapphire wafer on a holding surface of a chuck table; and a dividing step for cutting the sapphire wafer with the cutting blade rotating at a high speed held at the holding step to divide the sapphire wafer. In the cutting blade, diamond abrasive having a gain diameter of about 10-50 μm are bound by a vitrified bond having a porosity of about 30-70%. |
