LAMINATED BOARD, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a laminated board which allows the reduction in etching residue of copper foil, and offers a good wiring line in shape.SOLUTION: The laminated board has an insulator layer and a copper foil located at at least one face of the insulator layer, and is used for a device mount board. The device mount board is prepared in such a way that a conductor circuit is formed by etching the copper foil. On condition that the laminated board is immersed in a sulfuric acid/hydrogen peroxide-based etchant including 55.9 g/L of sulfuric acid and 19.6 cc/L of 34.5%-hydrogen peroxide solution and having a liquid temperature of 30±1°C, the etching rate of the copper foil is 0.68-1.25 μm/min.