发明名称 SURFACE MOUNT CLIP
摘要 A surface mount clip includes a base part having a rear surface electrically connected to a conductor part of a printed wiring board; and an extension part extending from the base part. The extension part contacts with a conductive member attached to the printed wiring board with elastic deformation of the extension part to hold the conductive member and make electrical connection thereto. The base part includes a solder-bonding part having a bonding plane to be bonded with the printed wiring board and a floating part forming a gap from the printed wiring board in a state that the solder-bonding part is solder-bonded to the printed wiring board. The extension part includes a root part extending from the floating part toward the rear surface of the base part and a folded-back part extending from an end of the root part toward a front surface of the base part.
申请公布号 US2013280968(A1) 申请公布日期 2013.10.24
申请号 US201313862574 申请日期 2013.04.15
申请人 KITAGAWA INDUSTRIES CO., LTD. 发明人 KURITA TOMOHISA
分类号 H01R4/48 主分类号 H01R4/48
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