| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a device allowing die lead frame connection which eliminates the need to form a wafer bump.SOLUTION: A method includes the steps of: placing a conductive material (106) on a protrusion (104) from a lead frame (102) to form a first assembly; forming a non-conductive mask (109) around the protrusion; and placing a die (110) on the first assembly, the die having an active region. The method can further include a step of reflowing the conductive material so as to form a second assembly such that a connection extends from the die active region to the protrusion (104) through the conductive material (106). A semiconductor package (100) includes: a lead frame (102) having a protrusion (104); a conductive material (106) reflowed to the protrusion (104); and a die (110) having an active region coupled to the protrusion (104) by a reflow solder (106). |
