| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board capable of reducing poor connections.SOLUTION: In a wiring board 11, three-layered insulating layers 31 to 33 are formed at an upper side (a first principle plane side) of a core substrate 21 and two-layered insulating layers 51 and 52 are formed at a lower side (a second principle plane side) of the core substrate 21. On a surface of the insulating layer 52, wiring patterns 63, and an insulating film 53a that covers between the wiring patterns 63, and the wiring patterns 63 and terminals, are formed. |
