| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid-cooling device in which a high heat generating component 6 and a low heat resistant component 7 are arranged adjacent to each other on the same card substrate 5, and simultaneously cooled by one heat receiving jacket 1, and which, when the liquid-cooling device is applied to a plug-in mounting apparatus in which the card substrate 5 mounted with the heat receiving jacket 1 is pulled out for maintenance, can prevent the transmission of the heat of the high heat generating component 6 to the adjacent low heat resistant component 7 in the maintenance caused because the cooling function of the heat receiving jacket 1 is rapidly lowered.SOLUTION: The heat receiving jacket 1 is attached to the card substrate 5 so as to cover the high heat generating component 6 and the low heat resistant component 7. The heat receiving jacket 1 includes a heat conduction member 2 which is arranged in the heat receiving jacket 1 so as to connect the upper and lower portions of the heat receiving jacket 1. A Peltier element 3 and a heat sink are arranged on the upper side of the heat receiving jacket 1. When the card substrate 5 is inserted, electromotive force from the Peltier element 3 and power in the card substrate 5 are charged. When the card substrate 5 is pulled out, the power is discharged so that the bottom surface of the Peltier element 3 becomes a cooling surface. |
