| 摘要 |
A circuit arrangement according to the invention has a substrate (10), a connecting element (18) and a chip (16). The substrate (10) has an at least partial metallisation (11) on the surface thereof. The connecting element (18) is applied to the metallisation (11). The chip (16) is applied to the connecting element (18). The connecting element (18) has an electrically non-conductive glass layer (14) which is applied directly to the metallisation (11), and an adhesive layer (15) between the chip (16) and the glass layer (14). |
