<p>An optical subassembly includes a thru optical via (104) formed through a semiconductor substrate (102), an optoelectronic component (108) secured to the substrate (102) such that an active region (106) of the optoelectronic component is aligned with the thru optical via (104), and circuitry (110) formed into the substrate (102), the circuitry to connect to and operate in accordance with the optoelectronic component (108).</p>
申请公布号
WO2013158068(A1)
申请公布日期
2013.10.24
申请号
WO2012US33798
申请日期
2012.04.16
申请人
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.;ROSENBERG, PAUL KESSLER;TAN, MICHAEL RENNE TY;MATHAI, SAGI VARGHESE;STRAZNICKY, JOSEPH
发明人
ROSENBERG, PAUL KESSLER;TAN, MICHAEL RENNE TY;MATHAI, SAGI VARGHESE;STRAZNICKY, JOSEPH