| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition showing excellence in all of low thermal expansion, adhesion to copper foil, heat resistance, flame retardancy, heat resistance (T-300) with copper and dielectric property, and to provide a prepreg and a laminate each using the thermosetting resin composition.SOLUTION: A thermosetting resin composition contains (A) produced by reacting a siloxane resin (a) having a primary amino group at its terminal, a compound (b) having at least two cyanate groups in one molecule, and a compound (c) having at least two epoxy groups in one molecule, and fused silica (B) surface-treated with a trimethoxysilane compound. A prepreg and a laminate use the thermosetting resin composition. |
