| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition showing excellence in low thermal expansion, adhesion to copper foil and heat resistance, and excellence also in glass transition temperature (Tg), flame retardancy, dielectric property and machinability of drilling, and to provide a prepreg and a laminate each using the thermosetting resin composition.SOLUTION: A thermosetting resin composition contains a compatibilized resin (A) obtained by reacting a siloxane resin (a) having a hydroxyl group at its terminal, a compound (b) having at least two cyanate groups in one molecule, a compound (c) having at least two epoxy groups in one molecule, and a compound (d) having at least two phenolic hydroxyl groups in one molecule in a specific mass ratio in a specific solvent. A prepreg and a laminate use the thermosetting resin composition. |
