发明名称 METHOD FOR PLATING METALLIC MATERIAL, AND COMPOSITE ELECTRODE OF SOLID POLYELECTROLYTE MEMBRANE AND CATALYTIC METAL
摘要 PROBLEM TO BE SOLVED: To enhance the rate of coverage with a plating film by suppressing poor plating of a metallic material.SOLUTION: A method for plating a metallic material includes a degreasing and cleaning step of degreasing and cleaning the surface of the metallic material, an etching step of forming anchors on the surface of the metallic surface, a first activation step of activating the surface of the metallic material with an activating solution, a first plating step of forming a plating film on the surface of the metallic material after the first activation step, a second activation step of reactivating the surface of the metallic material with an activating solution after the first plating step, and a second plating step of forming a plating film on the surface of the metallic material reactivated in the second activation step.
申请公布号 JP2013216940(A) 申请公布日期 2013.10.24
申请号 JP20120088127 申请日期 2012.04.09
申请人 MITSUBISHI ELECTRIC CORP 发明人 TAKEMOTO YOHEI;KAWASHITA RYUTA;MASUDA AKIO
分类号 C25D5/38;C23C18/18;C25B11/10;C25D5/10;C25D7/00 主分类号 C25D5/38
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