发明名称 PCB LAMINATE MATERIAL
摘要 <p>A PCB laminate material for mounting of LED comprises an intermediate layer which comprises nonwoven glass fiber impregnated with epoxy resin; and two woven glass layers impregnated with epoxy resin, wherein the woven glass layers are laminated over surfaces of the intermediate layer to form a sandwich structure; wherein the epoxy resin within the intermediate layer comprises a ceramic powder filler; and a thickness of each woven glass layer is 0.09 to 0.13mm.</p>
申请公布号 WO2013156906(A1) 申请公布日期 2013.10.24
申请号 WO2013IB52877 申请日期 2013.04.11
申请人 KONINKLIJKE PHILIPS N.V. 发明人 JIAO, FANGWEI;HU, RONGBAO;GUO, GUANGPIN;LIANG, XUAN;PEELS, WILHELMUS GERARDUS MARIA;CHANG, JUNQI;LI, XUEMEI;SHEN, CE;TSAI, CHING-HSIEN;JI, RUI;VAN WIJK, ROB
分类号 H05K1/03 主分类号 H05K1/03
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