Heat dissipation device and method for manufacturing the same

摘要

A heat dissipation device includes an insulating substrate, a metal layer connected to the insulating substrate via a first brazing filler material, a stress relaxation member connected to the insulating substrate via a second brazing filler material, and a cooler connected to the stress relaxation member via a third brazing filler material. The stress relaxation member has one or more stress relaxation spaces each including an opening that is open to at least one of a face side and a back side of the stress relaxation member. At least one of the second and third brazing filler materials has one or more through-holes. Each through-hole includes an opening overlapped with the opening of the stress relaxation space or with the opening of a corresponding one of the stress relaxation spaces, and an edge of each through-hole opening is located externally to an edge of the corresponding stress relaxation space opening.