发明名称
摘要 A cooling device for cooling a light-emitting semiconductor device, such as a LED device (20), comprises a ceramic plate (15) having coolant-conveying channels (12) incorporated therein. The ceramic plate (15) is adapted for forming an integral part of the optical system of the light-emitting semiconductor device (20) and to cool a light-emitting portion (26) of the light-emitting semiconductor device (20). A method of forming a cooling device comprises the steps of forming a charge of ceramic particles, embossing the charge with a stamp to form coolant-conveying channels in the charge, hardening the charge, and providing a cover on top of the channels to seal them.
申请公布号 JP5320060(B2) 申请公布日期 2013.10.23
申请号 JP20080508359 申请日期 2006.04.19
申请人 发明人
分类号 H01L23/427;H01L33/50;H01L33/64 主分类号 H01L23/427
代理机构 代理人
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