| 摘要 |
The present invention provides a resin covering method and a resin covering device for appropriately smoothing the heave and warpage of workpieces to make grinded workpieces form a rigorous flat state in the consideration of gravity. The surface (1a) of a wafer (1) is adsorbed on the adsorption surface (24a) of an adsorption part (24) of a pressing pad (23) for straightening the deformation of the wafer (1). Subsequently, the wafer (1) in a straightening state is loaded onto a resin (P1) in liquid state for being pressed, and then, after the pressing pad (23) is departed from the wafer (1) to make the wafer deformed to smooth the warpage and the like, the resin (P1) is solidified. Because, the wafer (1) is deformed on the resin (P1) from a straightening state, deformation caused by gravity force will not be generated, and the wafer in a rigorous flat state after being grinded can be obtained.
|
