发明名称
摘要 PROBLEM TO BE SOLVED: To provide a thin temperature conditioning mat, and a temperature conditioning floor using the temperature conditioning mat. SOLUTION: A floor heating mat 1 includes substrates 10-19, a groove 2 for housing piping provided on a top face of each substrate 10-19, a hot water piping 3 used as a temperature conditioning piping housed in the groove 2, a heat equalizing sheet 5 arranged so as to cover the top face of each substrate 10-19, a heat equalizing plate 6 arranged from an inner face of the groove 2 to the top face of each substrate 10-19, and a lining sheet 7 adhered to a bottom face of each substrate 10-19 so as to close a bottom of the groove 2. Each substrate 10-19 includes a thickness exposing the groove 2 in each bottom face. A depth of the groove 2 from the top face of each substrate 10-19 is substantially equal to a sum of an outer diameter of the hot water piping 3 and a thickness of the heat equalizing plate 6. In other words, a thickness of each substrate 10-19 is also substantially equal to the sum of the outer diameter of the hot water piping 3 and the thickness of the heat equalizing plate 6. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP5320777(B2) 申请公布日期 2013.10.23
申请号 JP20080057975 申请日期 2008.03.07
申请人 发明人
分类号 F24D3/10;F24D3/16 主分类号 F24D3/10
代理机构 代理人
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