| 摘要 |
PROBLEM TO BE SOLVED: To provide an abrasive for polishing a silicon wafer that improves the surface haze of the silicon wafer and especially never deteriorates the productivity of a mirror-finishing process of the silicon wafer, and also to provide a method of polishing the silicon wafer by using the same. SOLUTION: The abrasive for polishing a silicon wafer contains at least alkaline silica, a water-soluble high molecule, and a cyclic organic compound. The cyclic organic compound is water-soluble, has a molecular weight of ≥80 and <500, contains two or more oxygen atoms as atoms that form a cyclic structure. The cyclic organic component is added in a concentration of ≥0.1 wt.% and ≤500 wt.% with respect to the alkaline silica as a solid content. COPYRIGHT: (C)2011,JPO&INPIT |
