发明名称
摘要 PROBLEM TO BE SOLVED: To provide a wiring board for appropriately operating a semiconductor integrated circuit element by fully supplying power to the semiconductor integrated circuit element. SOLUTION: In the wiring board, through holes 5P for power supplies are positioned in a lower part of each row of via connection units 3V in a power plane 3P, and the via connection units 3V in each row of the power plane 3P and the through holes 5P for power supplies in the lower part thereof are electrically connected via vias 6 connected to the via connection units 3V in each row of the power plane. A power supply path to a semiconductor element connection pad 7 is not largely bypassed in the power plane 3P, power is fully supplied to the semiconductor integrated circuit element S, and then the semiconductor integrated circuit element S is appropriately operated. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP5322062(B2) 申请公布日期 2013.10.23
申请号 JP20100019834 申请日期 2010.01.31
申请人 发明人
分类号 H01L23/12 主分类号 H01L23/12
代理机构 代理人
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