发明名称 ENHANCED STACKED MICROELECTRONIC ASSEMBLIES WITH CENTRAL CONTACTS
摘要 A microelectronic assembly includes a dielectric element having first and second surfaces, first and second apertures extending between the first and second surfaces and defining a central region of the first surface between the first and second apertures, first and second microelectronic elements, and leads extending from contacts exposed at respective front surfaces of the first and second microelectronic elements to central terminals exposed at the central region. The front surface of the first microelectronic element can face the second surface of the dielectric element. The front surface of the second microelectronic element can face a rear surface of the first microelectronic element. The contacts of the second microelectronic element can project beyond an edge of the first microelectronic element. At least first and second ones of the leads can electrically interconnect a first central terminal of the central terminals with each of the first and second microelectronic elements.
申请公布号 EP2652783(A1) 申请公布日期 2013.10.23
申请号 EP20110719091 申请日期 2011.04.06
申请人 TESSERA, INC. 发明人 HABA, BELGACEM;ZOHNI, WAEL;CRISP, RICHARD, DEWITT
分类号 H01L23/49;H01L23/13;H01L23/66;H01L25/065;H01L25/10 主分类号 H01L23/49
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