| 摘要 |
<p>A structure of via hole (5) of electrical circuit board includes an adhesive layer (31) and a conductor layer (41) that are formed after circuit trace (21) is formed on a carrier board (100, 200, 300, 400, 500, 600, 700, 800, 900, 901). At least one through hole (5) extends in a vertical direction through the carrier board (100, 200, 300, 400, 500, 600, 700, 800, 900, 901), the circuit trace (21), the adhesive layer (31), and the conductor layer (41) and forms a hole wall surface (51). The conductor layer (41) shows a height difference (h1) with respect to an exposed zone (211) of the circuit trace (21) in the vertical direction. A conductive cover section (6) covers the conductor layer (41) and the hole wall surface (51) of the through hole (5). The carrier board (100, 200, 300, 400, 500, 600, 700, 800, 900, 901) is a single-sided board, a double-sided board, a multi-layered board, or a combination thereof, and the single-sided board, the double-sided board, and multi-layered board can be flexible boards, rigid boards, or composite boards combining flexible and rigid boards.</p> |
