摘要 |
<p>An improved ultrasound transducer assembly, e.g. a thickness-mode transducer assembly includes a plurality of elements comprising piezoelectric material, and a backing material disposed adjacent to a back surface of the plurality of elements. The piezoelectric material and backing material define at least a portion of a side surface, wherein an electrically conductive material is disposed upon and in contact with at least a portion of the side surface. The elements may comprise one or a plurality of front electrodes, and one or a plurality of back electrodes, wherein the front electrode(s) is electrically interconnected to the electrically conductive material disposed on the side surface portion. In a mass processing method, a plurality of thickness-mode ultrasound probe transducer assemblies may be produced, wherein a plurality of interconnected transducer subassemblies comprising a mass backing are processed in tandem.</p> |
申请人 |
GORE ENTERPRISE HOLDINGS, INC. |
发明人 |
ZIPPARO, MICHAEL, JOSEPH;JOHNSON, MONICA, PAGE;OAKLEY, CLYDE, GERALD;DIETZ, DENNIS, RAYMOND;LA BREE, MICHAEL, ROBERT;DONHOWE, MARK, NATHANIEL |