INTEGRATED CIRCUIT DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: An integrated circuit device package and a method for manufacturing the same are provided to be applied to a bending region by forming a protection member made of a flexible material. CONSTITUTION: A substrate has one surface and the other surface. The substrate comprises a line. An integrated circuit device (20) has the line and an electrical connection part surface-touching the line. A fixing member (24) insulates a residual region except the surface-touching region. A protection member (30) is formed on one surface of the substrate.