| 摘要 |
<p>PURPOSE: A substrate and a semiconductor device package using the same are provided to reduce manufacturing costs by reducing the size of a conductive material mounted on a device. CONSTITUTION: At least one device (200) is mounted on a substrate. A base substrate (110) has conductivity. The base substrate includes an upper surface, a lower surface, and a lateral surface. An insulator (120) is bonded to the base substrate. The area of the upper surface of the base substrate is same as the area of the lower surface of the base substrate.</p> |
