发明名称 |
SUPPORT FOR AN OPTOELECTRONIC SEMICONDUCTOR CHIP, AND SEMICONDUCTOR CHIP |
摘要 |
A support for an optoelectronic semiconductor chip includes a support body with a first main face and a second main face opposite the first main face, at least one electrical plated-through hole extending from the first main face to the second main face and formed in the support body, and an insulating layer arranged on the first main face, the insulation layer covering the electrical plated-through hole only in regions. |
申请公布号 |
EP2652785(A1) |
申请公布日期 |
2013.10.23 |
申请号 |
EP20110794094 |
申请日期 |
2011.12.05 |
申请人 |
OSRAM OPTO SEMICONDUCTORS GMBH |
发明人 |
HÖPPEL, Lutz |
分类号 |
H01L23/498;H01L25/16;H01L33/48;H01L33/62 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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