A semiconductor package that includes a semiconductor die and a heat spreader thermally coupled to the semiconductor and disposed at least partially within the molded housing of the package.
申请公布号
US8564124(B2)
申请公布日期
2013.10.22
申请号
US20070715226
申请日期
2007.03.07
申请人
BRIERE MICHAEL A.;CHEAH CHUAN;HU KUNZHONG;INTERNATIONAL RECTIFIER CORPORATION
