发明名称 |
Light-emitting device package |
摘要 |
A light-emitting device package including: a package main body including a cavity and a lead frame including a mounting portion disposed in the cavity and a plurality of terminal portions; a light-emitting device chip mounted on the mounting portion; a plurality of bonding wires for electrically connecting the plurality of terminal portions and the light-emitting device chip; a light-transmitting encapsulation layer filled in the cavity; and a light-transmitting cap member disposed in the cavity and blocking the encapsulation layer to contact the plurality of bonding wires.
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申请公布号 |
US8564005(B2) |
申请公布日期 |
2013.10.22 |
申请号 |
US201213347163 |
申请日期 |
2012.01.10 |
申请人 |
PARK JONG-KIL;YOU JAE-SUNG;ZHANG SUNG-UK;KIM TAE-GYU;LEE BANG-WEON;SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
PARK JONG-KIL;YOU JAE-SUNG;ZHANG SUNG-UK;KIM TAE-GYU;LEE BANG-WEON |
分类号 |
H01L33/50 |
主分类号 |
H01L33/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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