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发明名称
Holding pad for transferring a wafer
摘要
申请公布号
USD691974(S1)
申请公布日期
2013.10.22
申请号
US201229425315F
申请日期
2012.06.21
申请人
OSADA HIDEYUKI;TOKYO ELECTRON LIMITED
发明人
OSADA HIDEYUKI
分类号
主分类号
代理机构
代理人
主权项
地址
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