发明名称 |
Coupling heat sink to integrated circuit chip with thermal interface material |
摘要 |
Embodiments of the present invention provide a system for distributing a thermal interface material. The system includes: an integrated circuit chip; a heat sink; and a compliant thermal interface material (TIM) between the integrated circuit chip and the heat sink. During assembly of the system, a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip.
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申请公布号 |
US8564955(B2) |
申请公布日期 |
2013.10.22 |
申请号 |
US201113151144 |
申请日期 |
2011.06.01 |
申请人 |
SCHMIDT CHAD C;BLANCO, JR. RICHARD LIDIO;HEIRICH DOUGLAS L;HILLMAN MICHAEL D;MORT PHILLIP L;NIGEN JAY S;TICE GREGORY L;APPLE INC. |
发明人 |
SCHMIDT CHAD C;BLANCO, JR. RICHARD LIDIO;HEIRICH DOUGLAS L;HILLMAN MICHAEL D;MORT PHILLIP L;NIGEN JAY S;TICE GREGORY L |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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