发明名称 |
Test socket, and test apparatus with test socket to control a temperature of an object to be tested |
摘要 |
A test socket is provided that includes a socket body to receive an object to be tested, a lid disposed on the socket body, one or more pushers coupled to a first surface of lid to apply force to a first surface of the object toward the socket body, and a temperature controlling member to provide a temperature to the object. A semiconductor package may be tested in a test apparatus that includes the test socket, the methods of testing including receiving a semiconductor package in a socket in a test chamber, applying a first temperature to the test chamber to test the semiconductor package at a first test temperature, and applying a second temperature to the semiconductor package to test the semiconductor package at a second test temperature by controlling the application of the second temperature with the socket.
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申请公布号 |
US8564317(B2) |
申请公布日期 |
2013.10.22 |
申请号 |
US20100719267 |
申请日期 |
2010.03.08 |
申请人 |
HAN JONG-WON;GOH SEOK;MIN BYOUNG-JUN;KIM JUNG-HYEON;LEE SANG-SIK;KIM BO-WOO;CHOI HO-JEONG;SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
HAN JONG-WON;GOH SEOK;MIN BYOUNG-JUN;KIM JUNG-HYEON;LEE SANG-SIK;KIM BO-WOO;CHOI HO-JEONG |
分类号 |
G01R31/00 |
主分类号 |
G01R31/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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