发明名称 Silicon carbide semiconductor device and method for manufacturing same
摘要 A drift layer has a thickness direction throughout which a current flows and has an impurity concentration N1d for a first conductivity type. A body region is provided on a portion of the drift layer, has a channel to be switched by a gate electrode, has an impurity concentration N1b for the first conductivity type, and has an impurity concentration N2b for the second conductivity type greater than the impurity concentration N1b. A JFET region is disposed adjacent to the body region on the drift layer, has an impurity concentration N1j for the first conductivity type, and has an impurity concentration N2j for the second conductivity type smaller than the impurity concentration N1j. N1j-N2j>N1d and N2j<N2b are satisfied.
申请公布号 US8564017(B2) 申请公布日期 2013.10.22
申请号 US201213485423 申请日期 2012.05.31
申请人 HONAGA MISAKO;MASUDA TAKEYOSHI;WADA KEIJI;HIYOSHI TORU;SUMITOMO ELECTRIC INDUSTRIES, LTD. 发明人 HONAGA MISAKO;MASUDA TAKEYOSHI;WADA KEIJI;HIYOSHI TORU
分类号 H01L29/66;H01L21/337;H01L29/15 主分类号 H01L29/66
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