发明名称 Elastic wave device
摘要 In an elastic wave device that significantly reduces and prevents deterioration of a frequency characteristic without roughening an undersurface of a piezoelectric substrate, a structure is bonded to a surface of a piezoelectric substrate other than a main surface of the piezoelectric substrate on which IDTs are located. The structure is provided so that a path difference is defined between a first component and a second component of a bulk wave that is excited by the IDT and propagates in the piezoelectric substrate toward the bonding surface. The first component of the bulk wave is reflected from the bonding surface. The second component of the bulk wave enters the structure from the bonding surface, propagates in the structure, enters the piezoelectric substrate from the bonding surface, and propagates in the same direction as that of the first component reflected from the bonding surface in the piezoelectric substrate.
申请公布号 US8564173(B2) 申请公布日期 2013.10.22
申请号 US201213665973 申请日期 2012.11.01
申请人 MURATA MANUFACTURING CO., LTD. 发明人 MIYAKE TAKASHI
分类号 H01L41/08 主分类号 H01L41/08
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