发明名称 LIGHT EMITTING DIODE PACKAGE BY CHIP ON BOARD
摘要 Provided is an LED package including a printed circuit board (PCB); a conductive structure that is formed on the PCB and is composed of any one selected from a silicon structure and an aluminum structure; and an LED chip that is mounted on the PCB and is electrically connected to the PCB through the conductive structure.
申请公布号 KR101320514(B1) 申请公布日期 2013.10.22
申请号 KR20070083886 申请日期 2007.08.21
申请人 发明人
分类号 H01L33/48;H01L33/62 主分类号 H01L33/48
代理机构 代理人
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