| 摘要 |
The present invention relates to a resin for optical semiconductor element encapsulation containing a polyimide which is obtained by an imidation of a polyimide precursor obtained by a polycondensation of an aliphatic acid dianhydride with an aliphatic or aromatic diamine compound; and an optical semiconductor device containing the resin and an optical semiconductor element encapsulated with the resin. The resin for optical semiconductor element encapsulation according to the present invention exhibits excellent advantages that it has a high light-transmitting property, is excellent in heat resistance, and shows an excellent light resistance even against short-wavelength light. |
