METHOD FOR PRODUCING FABRIC BOARD WITH VIA-HOLE

摘要

PURPOSE: A method for manufacturing a fabric board with a via hole is provided to increase flexibility and durability by selectively attaching a fabric and an electronic part. CONSTITUTION: A method for manufacturing a fabric board with a via hole is as follows: a step of forming copper layers on the top and the bottom of an insulating layer to form a substrate (S100); a step of forming the via hole on the substrate with a drill (S200); a step of forming a circuit on the board with the via hole through an etching process (S300); a step of forming an adhesive layer on one side of the substrate (S400); a step of attaching a fabric on the adhesive layer (S500); and a step of sealing an electronic part on a solder gel layer (S600). [Reference numerals] (S100) Step of forming a substrate; (S200) Step of forming a via hole; (S300) Step of forming a circuit; (S400) Step of forming a protective film layer; (S500) Step of attaching a fabric; (S600) Step of sealing an electronic part; (S700) Step of performing a urethane molding